EEGR 317 Final Project – DRAM vs SRAM

EEGR 317 Final Project – DRAM vs SRAM

Introduction:

It is acknowledged that the development of transistors allowed for some of the biggest technological advances for mankind. Transistors applicability to a variety of electrical engineering functions allowed for the creation of a number of devices. More so the mosfet, with its capabilities, allowed for the development and advancement of computer technology. One of the main parts of computers that mosfets are involved in are random access memory (RAM). There are two main types of RAM: DRAM (dynamic random access memory) and SRAM (static random access memory). These types of RAM are composed of memory cells that consists of mosfets. In this project, students will explore and design their own DRAM and SRAM cells.

Objective:

            The students are tasked with designing DRAM and SRAM memory cells, using LT Spice, and perform a comparison and a contrast of both types of RAM. The specifications of the project will be outlined below.

Fig. 1 – RAM

Design Phase I:

Fig. 2 – Memory Cell

Memory cells are powered by two different lines of voltage sources. Those lines are called the Word Line and the Bit Line. As shown above the Word Line runs either as a row or a column, while the Bit Line runs perpendicular to it. The Word Line acts a signal that access the memory cell so that a write or read function may be performed. The Bit Line is the signal that controls the reading and writing of a bit. Shown below are examples of the Word and Bit lines operating for a DRAM and SRAM.




Figure 3 – DRAM Memory Operation
Fig. 4 – SRAM Memory Operation

Initial DRAM Specifications:

  • Build a 4×4 DRAM memory circuit
  • Word and Bit lines must be powered by 6V sources.
  • The output voltage may range from 4V to 4.5V when memory is stored
  • The “bit” must be read for 2ns
  • The “bit” must be stored for 1ns
  • The “bit” must be written in 1ns
  • A memory cell must obtain the maximum current of 2mA

Initial SRAM Specifications:

  • Build a 2×2 SRAM memory circuit
  • Word and Bit lines must be powered by 6V sources
  • The “bit” must be stored for 3ns
  • The output voltage must be 4V when memory is stored
  • The output voltage must be 2V when there is no memory stored
  • The current when a “bit” is stored should be 180uA

Design Comprehension:

  • Vary the signal coming into the word line to be greater than the bit line. Explain how does that affect memory storage (variance between word line and bit line must be 1V or more).
  • Vary the signal coming into the word line to be lower than the bit line. Explain how does that affect memory storage (variance between word line and bit line must be 1V or more).
  • Vary the signal coming into the word line to be faster than the bit line. Explain how does that affect memory storage.
  • Vary the signal coming into the word line to be slower than the bit line. Explain how does that affect memory storage.

Design Phase II:

            Sense amplifiers are circuits built to work with RAM. They operate by detecting low power signals along the bit line, amplify them to recognizable logic levels at the output. There are two different types of sense amplifiers, a differential sense amplifier (which operates for voltage), and a non-differential sense amplifier (which operates for current).

            Sense Amplifier Specifications:

  • Design a differential sense amplifier for both circuits in the previous design phase
  • Design the sense amplifier so that an output of 3V would be recognized as a “1”
  • The reference signal going into the sense amplifier must be 5V
  • Design the appropriate number of sense amplifiers for the memory circuits

Discussion Questions:

  • Explain the significant differences that were noticed between DRAM and SRAM. What are scenarios where DRAM would be preferred? What are scenarios where SRAM would be preferred?

Report:

            Write a detailed report showing the findings from the simulation and answers to the discussion questions. This report must be written in IEEE format (please review IEEE format and observe uploaded example on Canvas) with proper citations from referenced material. Report must include all necessary hand calculations made, as well as necessary image. The report must be between four to 6 pages in total. NO LATE SUBMISSIONS OF THE REPORT WILL BE ACCEPTED WITHOUT PROPER REASON.

Grading:

Title – 5%

Abstract – 10%

Background/Introduction – 30%

Methodology – 30%

Results – 15%

Conclusion – 10%

Students will lose points if the report:

  • Is incomplete
  • Unorganized
  • Does not follow IEEE format
  • Usage of pronouns
  • Improper citations
  • Unrecognizable images
  • Does not include all graded sections

*Plagiarism or no citation for material will result in a score of zero for the report. Images from the internet are inclusive of this.

References:

Handy, Jim. “Emerging Memories Today: Understanding Bit Selectors.” The Memory Guy, 23 Jan. 2019, thememoryguy.com/emerging-memories-today-understanding-bit-selectors/.

Wie, C. Introduction, jas.eng.buffalo.edu/education/system/memory/intro.html.

windows101tricks. “Static RAM Vs Dynamic RAM, Which Is Better?” Medium, Medium, 6 Apr. 2018, medium.com/@win10tricks/static-ram-vs-dynamic-ram-which-is-better-4d691c052781.

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